Overview

The RCB400 A10-04 is an advanced control system—integrating motion control, robotic control, and AI computing—powered by the NVIDIA® Jetson AGX Orin™. Purpose-built for high-performance robotics and AI-driven automation, it combines embedded motion control with edge AI acceleration to streamline the development of humanoid and quadruped robots.

Equipped with the NVIDIA® Jetson AGX Orin™ 64GB system-on-module (SOM), the RCB400 A10-04 features an Ampere GPU with up to 2048 CUDA cores, 64 Tensor Cores, and dual NVDLA 2.0 engines, delivering up to 275 sparse INT8 TOPS for real-time AI inference and multi-stream video processing.

For connectivity and expansion, the system supports a comprehensive suite of validated interfaces, including 8× GbE, 4× COM, 4× USB 3.2, 2× CAN, 8× GMSL, and 8× GPIO, enabling precise high-speed control and seamless integration with a wide range of sensors and actuators. Its rugged, industrial-grade design ensures long-term reliability in challenging research and industrial environments, making the MARS400 A10-04 an ideal platform for next-generation robotic innovation.

Main Features

MAIN FEATURE

  • NVIDIA® Jetson AGX Orin™ System-on-Module (SOM)

  • NVIDIA® Ampere GPU and Arm Cortex-A78AE

  • 64GB LPDDR5 on SOM

  • 64GB eMMC 5.1 on SOM

  • Single Display: HDMI

  • 3 x USB 3.2 Gen1 Type A

  • 1 x USB 3.2 Gen2 Type C

  • 2 x RSS232/422/485, 2 x RS232 by pin header

  • 2 x CAN FD by pin header

  • 8 x RJ45 port

  • 8 x GMSL (optional)

  • 3 x M.2 Slot

  • 16 x DIO(8IN, 8 Out) by pin header

  • DC 24V to 48V input

  • Support 0~60 °C operating temperature

Specifications

CPU / GPU

  • 12-core Arm® Cortex® A78AE v8.2 64-bit Integrated cache: 3MB L2 + 6MB L3 Equipped
  • 2048-core NVIDIA Ampere GPU with 64 Tensor Cores

Main Memory

  • 64GB 256-bit @ 3200MHz 204.8GB/s (+ECC)

Storage

  • 1 x M.2 2280 M key x 1 (support SATA/PCIe interface, up to 512GB)
  • 64GB eMMC 5.1 on Jetson AGX Orin board

Rear I/O

  • 1 x HDMI
  • 8 x RJ45 LAN
  • 1 x 10Gb LAN
  • 3 x USB 3.2 Gen1
  • 1 x USB 3.2 Gen2
  • 4 x LED
  • 1 x 3pin power connector

Internal I/O

  • 1 x 120-pin Samtec connector for GMSL module
  • 4 × COM port (2 x RS232/422/485, 2 x RS232)
  • 2 x CAN FD
  • 1 x MIC-in , 1 x Line-out
  • 16 DIO(8IN, 8OUT)

Expansion Slot

  • 1 × M.2 Key B 3042/3052 (PCIe x 1, USB3.0), support 4G/5G module
  • 1 × M.2 Key E 2230 (PCIe x 1 Gen 1, USB2.0), support WiFi/BT module
  • 1 x PCIe x16 slot : only support x8 signal, power max 25w
Power Requirement
  • DC 24V to 48V input

Dimensions

  • 170(W) x 190(H) mm

Environmen

  • Operating temperature: Ambient with air flow: 0°C to 60°C (according to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
  • Storage temperature: -20°C to 85°C
  • Relative humidity: 25~50°C, 90% (non-condensing)

Certifications

  • CE
    - EN61000-6-2, EN61000-6-4
  • FCC Class A

Ordering Information

  • RCB400 A10-04 (P/N: 10J200RCB22X0)

    NVIDIA® Jetson AGX Orin™ System-on-Module